I want to apply my paste wax with my PC but don't want to take it out of the jar as I will probably drop it, and think I will use too much product with the putty knife or wrench application.
I currently use the 4" spot buf pad on a polishin pal, which is super easy to apply to the pad as it fits right in the jar, and figure that will work good on a 3.5" backing plate on my PC, but haven't seen that mentioned as an option on any of the threads I read thru about machine polishing - does anyone know of a reason that would be a bad idea?
I currently use the 4" spot buf pad on a polishin pal, which is super easy to apply to the pad as it fits right in the jar, and figure that will work good on a 3.5" backing plate on my PC, but haven't seen that mentioned as an option on any of the threads I read thru about machine polishing - does anyone know of a reason that would be a bad idea?